The category of technology is one of the most competitive in the world, since the main brands in the market offer more and more products and services for their users, with the aim of being your first choice. In the case of computers and their components, this is much more evident, since, for example, chips they were one of the most requested elements in recent years to the point of experiencing a shortage at the international.
Therefore, in order to improve this sector, an alliance has emerged between the giants Samsung, AMD, Intel, Qualcomm, Google, and METAthus announcing the Universal Interconnect Expressor eICU in their official abbreviations, which will be a new standard with great benefits for the industry.
According to the official announcement, the UCIe will legally allow the combination of various and different elements in chiplets of each of the Business that belong to this new group. These chiplets are capsules of components that are combined to create a even bigger and more powerful chip. All its details have not yet been revealed, but it is known that they are smaller and cheaper.
YOU CAN SEE: Bill Gates predicts that this technology will soon replace cell phones
Meanwhile, the main difference is that these new elements are much easier to make and assemble compared to a monolithic architecture chip. In addition, the standardization of these components will facilitate the manufacture of other devices, will reduce the cost of production and speed up time to marketbecause this process will no longer depend on just one company, but all those in charge will be able to supervise it.